图书信息
作译者：积体电路测试仪器与装备产业技术创新联盟
中国积体电路检测和测试产业技术创新路线图
中国积体电路检测和测试产业技术创新路线图出版时间：2019-04
千 字 数：188
版次：01-01
页 数：172
开本：16开
装帧：
I S B N ：9787121360589
纸质书定价：￥69.0
图书目录
第一章 积体电路工艺品质控制检测技术与产品.........................................1
一、积体电路产业中的工艺品质控制概况··················································1
（一）积体电路产业链与工艺品质控制检测布局································1
（二）工艺品质控制检测技术和设备发展趋势····································2
（三）工艺品质控制检测设备市场整体情况········································4
二、硅製程（前道）中的关键工艺品质控制检测技术与设备··················4
（一）图形化表面检测技术与设备························································7
（二）无图形表面检测技术与设备······················································20
（三）光刻套刻对準测量技术与设备··················································23
（四）其他分析及检测技术与设备······················································25
（五）前道製程中的工艺品质控制检测的整体发展趋势··················26
三、晶圆级封装（中道）中的关键工艺品质控制检测技术与设备········29
（一）三维表面形貌测量技术与设备··················································30
（二）自动光学检测技术与设备（中道）··········································35
（三）无图形表面检测技术与设备······················································37
（四）中道製程中的工艺品质控制检测的整体发展趋势··················37
四、基板与传统封装测试（后道）中的关键工艺品质控制检测技术
与设备····································································································38
（一）自动光学检测技术与设备（后道）········································· 38
（二）自动X 射线检测技术与设备···················································· 41
（三）后道製程中的工艺品质控制检测的整体发展趋势················· 42
第二章 自动化测试设备技术与产品......................................................... 43
一、晶片/模组测试市场需求及发展趋势·················································· 43
（一）电源管理类晶片的测试需求及趋势········································· 47
（二）CIS 晶片的测试需求及趋势······················································ 47
（三）逻辑/混合信号晶片的测试需求及趋势···································· 49
（四）存储器晶片的测试需求及趋势················································· 52
（五）LCD Driver晶片的测试需求及趋势········································· 54
二、ATE 自动测试机械手的现状及发展方向··········································· 57
三、模拟及电源管理晶片ATE 设备发展现状及趋势······························ 59
四、逻辑/混合信号ATE 测试系统的发展现状及趋势····························· 60
五、存储器ATE 测试系统的发展现状及趋势·········································· 62
六、LCD Driver 测试系统的发展现状及趋势··········································· 63
七、其他定製化专用积体电路测试设备发展的方向及趋势··················· 65
八、SLT 测试技术的特点及行业发展前景··············································· 67
九、指纹晶片/模组的测试发展趋势·························································· 69
十、MEMS晶片的测试发展趋势······························································ 71
十一、与晶片可测性设计结合的ATE 设备一体化方案路线·················· 73
第三章 测试服务...................................................................................... 75
一、测试服务——平台技术······································································· 77
（一）整体技术需求············································································· 77
（二）发展趋势····················································································· 77
（三）重点方向····················································································· 78
二、测试服务——共性技术······································································· 81
（一）整体技术需求············································································· 81
（二）重点方向····················································································· 82
（三）发展趋势····················································································· 84
三、测试服务——产品测试解决方案························································84
（一）先进工艺IP 核测试解决方案····················································85
（二）先进封装测试解决方案······························································87
（三）先进核心产品测试解决方案······················································90
第四章 军用与民用积体电路测试差异性研究与技术发展....................... 102
一、整体技术需求······················································································102
二、发展趋势······························································································103
三、重点方向······························································································105
（一）宽温测试技术············································································105
（二）抗辐照测试技术········································································107
（三）电磁环境效应测试技术····························································110
（四）全参数、全功能测试技术························································113
（五）故障及失效测试技术································································115
（六）老炼试验技术············································································117
（七）可测性设计与验证技术····························································119
第五章 电力电子的测试技术与产品....................................................... 125
一、电力电子产品技术现状······································································125
（一）功率二极体技术发展及产品····················································127
（二）功率MOSFET 技术发展及产品··············································129
（三）IGBT 技术发展及产品·····························································130
二、功率半导体器件测试技术··································································132
（一）功率半导体器件稳态参数测试················································132
（二）动态参数测试············································································134
（三）功率半导体器件UIS 雪崩耐量测试技术································146
（四）功率半导体器件热阻测试技术················································150
三、功率半导体器件测试发展趋势及路线图··········································153
第六章 市场发展格局............................................................................. 155
一、全球封装测试业··················································································156
（一）行业规模····················································································156
（二）产业布局··················································································· 157
（三）重点企业排名··········································································· 157
二、我国封装测试业················································································· 158
（一）行业规模··················································································· 158
（二）产业布局··················································································· 159
（三）重点企业排名··········································································· 159